2:00 PM - 2:15 PM
Toshitsugu Sakamoto1, Makoto Miyamura1, ○Kazunori Funahashi1, Munehiro Tada1, Ken Uchida2, Hiroki Ishikuro3 (1. NanoBridge Semiconductor, Inc. (Japan), 2. Univ. of Tokyo (Japan), 3. Keio Univ. (Japan))
Oral Presentation
01: Advanced CMOS: Material Science / Process Engineering / Device Technology
Wed. Sep 6, 2023 2:00 PM - 3:45 PM Room F (224, Bldg. 2)
Session Chairs: Satofumi Souma (Kobe Univ.), Hidetoshi Oishi (Sony Semiconductor Solutions Corp.)
2:00 PM - 2:15 PM
Toshitsugu Sakamoto1, Makoto Miyamura1, ○Kazunori Funahashi1, Munehiro Tada1, Ken Uchida2, Hiroki Ishikuro3 (1. NanoBridge Semiconductor, Inc. (Japan), 2. Univ. of Tokyo (Japan), 3. Keio Univ. (Japan))
2:15 PM - 2:30 PM
○Pierre EYBEN1, Pierre De Keersgieter1, Philippe Matagne1, Thomas Chiarella1, Clément Porret1, Andriy Hikavyy1, Yong Kong Siew1, Ludovic Goux1, Jérôme Mitard1, Naoto Horiguchi1 (1. Imec (Belgium))
2:30 PM - 2:45 PM
○Camila Cavalcante1, H. Arimura1, Y. Oniki1, F. Sebaai1, E. Capogreco1, L-A. Ragnarsson1, B.T. Chan1, A. Hikavyy1, H. Mertens1, K. Vandersmissen1, E. Dentoni Litta1, S. Subramanian1, S. Biesemans1, N. Horiguchi1 (1. imec (Belgium))
2:45 PM - 3:00 PM
○Luping Wang1, Junkang Li1, Rui Zhang1 (1. Zhejiang Univ. (China))
3:00 PM - 3:15 PM
○Xinze Li1, Sebastien Loubriat2, Guillaume Besnard3, Christophe Maleville3, Olivier Weber4, Ran Cheng1 (1. Zhejiang Univ. (China), 2. CEA-LETI Corp. (France), 3. SOITEC Corp. (France), 4. STMicroelectronics Corp. (France))
3:15 PM - 3:30 PM
○Jinghan Xu1, Mengqi Fan1, Zixuan Sun1, Fei Liu1, Xiaoyan Liu1 (1. Peking University (China))
3:30 PM - 3:45 PM
○Junichi Hattori1, Koichi Fukuda1, Tsutomu Ikegami1, Yoshihiro Hayashi1 (1. AIST (Japan))
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