Yi-Han Huang¹, Kuan-Chung Chiu¹, ^○Yu-Jie Teng¹, Burn Jeng Lin¹, Jiaw-Ren Shih², Faith Yuh², Yue-Der Chih², Jonathan Chang², Chrong Jung Lin¹, Ya-Chin King¹ (1. Inst. of Electronics Engineering, National Tsing Hua Univ. (Taiwan), 2. Taiwan Semiconductor Manufac. Company (Taiwan))

^○Hye Yeon Park¹, Sang-In Bae¹, Yunki Lee¹, Tao Feng², Tong Cheng², Peide Li², Wei Zhang², Baotan Jiang², Jinmyoung Mok¹, Younggyu Jeong¹, Kyoungyong Choi¹, Bumsuk Kim¹, Jungchak Ahn¹ (1. Samsung Electronics (Korea), 2. vivo Communication Technology Co. Ltd (China))

^○Shuto Ishimoto¹, Mitsuo Sakashita¹, Masashi Kurosawa¹, Osamu Nakatsuka¹, Shigehisa Shibayama¹ (1. Nagoya Univ. (Japan))

^○Haruki Yonezaki¹, Takayuki Mori¹, Jiro Ida¹ (1. Kanazawa Inst. of Tech. (Japan))