[G-1] Advanced Metallization I

Wed. Sep 6, 2023 2:00 PM - 3:30 PM Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

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2:00 PM - 2:30 PM

[G-1-01 (Invited)] Considerations for post-Cu Alternative Metal BEOL Interconnects ~ Challenges and Solutions ~

^○Koichi Motoyama¹ (1. IBM Res. (United States of America))

2:30 PM - 2:45 PM

[G-1-02] Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects

^○Gilles Delie¹, Elisabeth Camerotto², Giulio Marti¹, Ankit Pokhrel¹, Gayle Murdoch¹, Anshul Gupta¹, Stefan Decoster¹, Souvik Kundu¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium), 2. Lam Research Belgium (Belgium))

2:45 PM - 3:00 PM

[G-1-03] Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

^○Chen Wu¹, Vincent Renaud¹, Stephane Lariviere¹, Stefan Decoster¹, Yannick Hermans¹, Quoc Toan Le¹, Hanne DeCoster¹, Bart Kenens¹, Diana Tsvetanova¹, Alfonso Sepulveda Marquez¹, Gayle Murdoch¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium))

3:00 PM - 3:15 PM

[G-1-04] Optimizations on resistivity of binary compounds for advanced interconnect metallization

^○Jean- Philippe Soulie¹, Nancy Heylen¹, Jeroen Scheerder¹, Claudia Fleischmann^1,2, Zsolt Tőkei¹, Christoph Adelmann¹ (1. Inst. IMEC (Belgium), 2. Univ. of Leuven (KUL) (Belgium))

3:15 PM - 3:30 PM

[G-1-05] Superconducting Hollow TSV for Quantum Computing

^○Jaber Derakhshandeh¹, Roy Li¹, Geraldine Jamieson¹, Gabriela dos Santos², Bogdan Govoreanu¹, Andy Miller1¹, Eric Beyne¹ (1. IMEC (Belgium), 2. Beneq (Finland))

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