Oral Presentation
03: Interconnect / 3D Integrations / MEMS
Wed. Sep 6, 2023 4:00 PM - 5:30 PM Room G (231, Bldg. 2)
Session Chairs: Akinobu Yamaguchi (Univ. of Hyogo), Takeo Minari (NIMS)
4:00 PM - 4:30 PM
○Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))
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4:30 PM - 4:45 PM
○Kisuke Miyado1, Tenneti Devi Srujana1, Akira Onishi1, Katsuyuki Machida1, Tomoyuki Kurioka1, Parthojit Chakraborty1, Tso-Fu Mark Chang1, Masato Sone1, Yoshihiro Miyake1, Hiroyuki Ito1 (1. Tokyo Institute of Technology (Japan))
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4:45 PM - 5:00 PM
○Lingying Li1, Wanli Li2, Masayuki Kanehara3, Takeo Minari1 (1. NIMS (Japan), 2. Jiangnan Univ. (China), 3. C-INK Co., Ltd. (Japan))
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5:00 PM - 5:15 PM
○Gauri Vibhakar Karve1, Yunlong Li2, Vasyl Motsnyi1, Wei Wei1, Jakob Visker1, Francois Chancerel1, Jan Ackaert1, Renaud Puybaret1, Barundeb Dutta1, Deniz Sabuncuoglu Tezcan1, Lan Peng1, Philippe Soussan1, Simone Severi1, Haris Osman1 (1. IMEC (Belgium), 2. Zhejiang University (China))
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5:15 PM - 5:30 PM
○Guofang Yu1, Renrong Liang1, Congyi Zhu2, Haiming Zhao1, Jing Wang1, Jun Fu1 (1. Tsinghua Univ. (China), 2. Nanjing Univ. of Aero. and Astr. (China))
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