^○Yoko Yoshimura¹, Kunifumi Suzuki¹, Reika Ichihara¹, Kiwamu Sakuma¹, Kota Takahashi¹, Kazuhiro Matsuo¹, Makoto Fujiwara¹, Masumi Saitoh¹ (1. Kioxia Corp. (Japan))

^○Yuyan Fan^1,2, Shunda Zhang³, Yulong Dong^1,2, Danyang Chen^1,2, Jiahui Zhang^3,4, Jingquan Liu¹, Mengwei Si¹, Yanwei Cao³, Xiuyan Li¹ (1. National Key Lab. of Sci. and Tech. on Micro/Nano Fabrication (China), 2. Department of Micro/Nano Electronics, Shanghai Jiao Tong Univ. (China), 3. Ningbo Inst. of Materials Tech. and Eng., Chinese Academy of Sci. (China), 4. Faculty of Electrical Eng. and Computer Sci., Ningbo Univ. (China))

^○Cheng-Hung Wu¹, Chun-Jung Su², Vita Pi-Ho Hu¹ (1. National Taiwan Univ. (Taiwan), 2. National Yang Ming Chiao Tung Univ. (Taiwan))

^○Xiaoyu Ke^1,2, Junshuai Chai^1,2, Hao Xu^1,2, Xiaolei Wang^1,2, Wenwu Wang^1,2 (1. Key Lab. of Microelectronics Devices and Integrated Tech., Inst. of Microelectronics, Chinese Academy of Sci. (China), 2. College of Integrated Circuits, Univ. of Chinese Academy of Sci. (China))

^○Yueyuan - Zhang¹, Yue - Peng¹, Fenning - Liu¹, Yan - Liu¹, Yue - Hao¹, Genquan - Han¹ (1. Xidian Univ. (China))