^○Tianlin Yang¹, Takashi Onaya², Koji Kita^1,2 (1. Department of Materials Engineering, The Univ. of Tokyo (Japan), 2. Department of Advanced Materials Sci., The Univ. of Tokyo (Japan))

^○Qian Zhang^1,2, Nannan You¹, Jiayi Wang¹, Yang Xu¹, Yu Wang^1,2, Kuo Zhang^1,2, Shengkai Wang^1,2 (1. Inst. of Microelectronics of the Chinese Academy of Sci. (China), 2. Univ. of Chinese Academy of Sci. (China))

^○Qiao Chu¹, Masahiro Masunaga², Akio Shima², Koji Kita¹ (1. The University of Tokyo (Japan), 2. Hitachi, Ltd. R&D Group (Japan))

^○Keisuke Utsumi¹, Hajime Tanaka¹, Nobuya Mori¹ (1. Osaka Univ. (Japan))

^○Runze Wang¹, Munetaka Noguchi², Hiroshi Watanabe², Koji Kita¹ (1. Univ. of Tokyo (Japan), 2. Mitsubishi Electric Corp. (Japan))