[PS-3] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

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[PS-3-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

^○Mu-Ping Hsu¹, Hsin-Chi Chang¹, Yi-Chieh Tsai¹, Kuan-Neng Chen¹ (1. National Yang Ming Chiao Tung Univ. (Taiwan))

[PS-3-02] Using a CMOS MEMS Resonator System for Rapid Calibration of Thin Film Deposition Thickness

^○Cheng-Yang Chang¹, Chin-Te Hsin¹, Ying-Zong Juang¹, Sheng-Hsiang Tseng¹ (1. National Applied Research Laboratories Taiwan Semiconductor Research Institute (Taiwan))

[PS-3-03] On the Study of ESD-Induced Electromigration in CMOS Metallization

^○Yang-Shou Hou¹, Chun-Yu Lin¹ (1. National Taiwan Normal Univ. (Taiwan))

Cancelled

[PS-3-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

^○Meng-Hua TU¹, CHIA-LIN HSIEH¹, Sung-Mao Wu¹, Shang-Chih Chou² (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

[PS-3-05] Investigation of Spin-Orbit-Torque-induced modulation of magnetization dynamics via rectifying planar Hall effect

^○Akinobu Yamaguchi¹ (1. University of Hyogo (Japan))

[PS-3-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

^○Karl Gerard Herman Ceulemans¹, Ehsan Shafahian¹, Katia Devriendt¹, Herbert Struyf¹, Jaber Derakhshandeh¹ (1. IMEC (Belgium))

[PS-3-07 (Late News)] Light Enhanced Direct Copper Bonding and the Drop Test Reliability

Zong-Yu Xie¹, Po-Kai Huang¹, ^○Wei-Ting Chen¹, Chih-Pin Hung², Kiyokazu Yasuda³, Jenn-Ming Song^1,3,4 (1. National Chung Hsing University (Taiwan), 2. Advanced Semiconductor Engineering Group (Taiwan), 3. Division of Materials and Manufacturing Science (Japan), 4. Innovation and Development Center of Sustainable Agriculture (Taiwan))

[PS-3-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez¹, Akio Wakejima², Atsushi Tanaka³, ^○Tadatomo Suga¹ (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))

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