Poster Session
03: Interconnect / 3D Integrations / MEMS
Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)
○Mu-Ping Hsu1, Hsin-Chi Chang1, Yi-Chieh Tsai1, Kuan-Neng Chen1 (1. National Yang Ming Chiao Tung Univ. (Taiwan))
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○Cheng-Yang Chang1, Chin-Te Hsin1, Ying-Zong Juang1, Sheng-Hsiang Tseng1 (1. National Applied Research Laboratories Taiwan Semiconductor Research Institute (Taiwan))
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○Yang-Shou Hou1, Chun-Yu Lin1 (1. National Taiwan Normal Univ. (Taiwan))
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Cancelled
○Meng-Hua TU1, CHIA-LIN HSIEH1, Sung-Mao Wu1, Shang-Chih Chou2 (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))
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○Akinobu Yamaguchi1 (1. University of Hyogo (Japan))
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○Karl Gerard Herman Ceulemans1, Ehsan Shafahian1, Katia Devriendt1, Herbert Struyf1, Jaber Derakhshandeh1 (1. IMEC (Belgium))
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Zong-Yu Xie1, Po-Kai Huang1, ○Wei-Ting Chen1, Chih-Pin Hung2, Kiyokazu Yasuda3, Jenn-Ming Song1,3,4 (1. National Chung Hsing University (Taiwan), 2. Advanced Semiconductor Engineering Group (Taiwan), 3. Division of Materials and Manufacturing Science (Japan), 4. Innovation and Development Center of Sustainable Agriculture (Taiwan))
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Nora Martinez1, Akio Wakejima2, Atsushi Tanaka3, ○Tadatomo Suga1 (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))
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