2023 International Conference on Solid State Devices and Materials

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Oral Presentation

08: Low Dimensional Devices and Materials

[A-7] Device Application III: Low Dimensional Devices and Materials

Fri. Sep 8, 2023 1:30 PM - 2:45 PM Room A (131+132, Bldg. 1)

Session Chairs: Shengnan Wang (NTT Basic Research Laboratories), Yusuke Hoshi (Tokyo City Univ.)

2:00 PM - 2:15 PM

[A-7-02] A Ballistic Transport Investigation of High Performance CNTFETs with Interface Engineering: Virtual Source Parameter Extraction and SPICE Circuit Analysis

○Yuchen Gu1, Mengyu Zhao2, Zhihan Liu2, Junru Qu1, Ying Sun1, Yinfan Ouyang2, Wei Sun2, Ran Cheng1 (1. Univ. of Zhejiang (China), 2. Univ. of Peking (China))

https://doi.org/10.7567/SSDM.2023.A-7-02

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