The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

Sep 5, 2023 - Oct 31, 2023
Nagoya Congress Center

10:45 AM - 11:15 AM

[E-4-01 (Invited)] Polysilicon channel in 3-D NAND: Challenges and Strategies for Improvement

○Sivaramakrishnan Ramesh1 (1. imec (Belgium))

https://doi.org/10.7567/SSDM.2023.E-4-01

The 3-D NAND industry is currently exploring beyond 300 layers. Polysilicon channel, rich in defects, is a major cause of concern for the string read operation in tall 3-D NAND. Technological innovations, such as, macaroni channel, H2 passivation, grain size engineering techniques and alternative crystallization processes help to keep 3-D NAND in a viable scaling path.