3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structuresin Nano-scaled CMOS Processing Node

Li-Yu Yeh

doi:https://doi.org/10.7567/SSDM.2023.F-8-03

講演情報

Oral Presentation

01: Advanced CMOS: Material Science / Process Engineering / Device Technology

[F-8] Advanced CMOS: Device Technology 2

2023年9月8日(金) 15:30 〜 16:30 Room F (224, Bldg. 2)

Session Chairs: Keisuke Yamamoto (Kyushu Univ), Anabela Veloso (imec)

16:15 〜 16:30

[F-8-03] 3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structuresin Nano-scaled CMOS Processing Node

Li-Yu Yeh¹, ^○Ya-Lin Chang¹, Yue-Der Chih², Jonathan Chang², Chrong-Jung Lin¹, Ya-Chin King¹ (1. National Tsing Hua University (Taiwan), 2. Design Technology Platform, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan (Taiwan))

https://doi.org/10.7567/SSDM.2023.F-8-03

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講演情報

[F-8] Advanced CMOS: Device Technology 2

[F-8-03] 3D Stack Ultra High Resistance Via Matrix by Cu BEOL Structuresin Nano-scaled CMOS Processing Node

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