Superconducting Hollow TSV for Quantum Computing

Jaber Derakhshandeh

doi:https://doi.org/10.7567/SSDM.2023.G-1-05

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Advanced Metallization I

Wed. Sep 6, 2023 2:00 PM - 3:30 PM Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

3:15 PM - 3:30 PM

[G-1-05] Superconducting Hollow TSV for Quantum Computing

^○Jaber Derakhshandeh¹, Roy Li¹, Geraldine Jamieson¹, Gabriela dos Santos², Bogdan Govoreanu¹, Andy Miller1¹, Eric Beyne¹ (1. IMEC (Belgium), 2. Beneq (Finland))

https://doi.org/10.7567/SSDM.2023.G-1-05

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Presentation information

[G-1] Advanced Metallization I

[G-1-05] Superconducting Hollow TSV for Quantum Computing

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