Superconducting Hollow TSV for Quantum Computing

Jaber Derakhshandeh

doi:https://doi.org/10.7567/SSDM.2023.G-1-05

講演情報

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-1] Advanced Metallization I

2023年9月6日(水) 14:00 〜 15:30 Room G (231, Bldg. 2)

Session Chairs: Christian Dussarrat (Air Liquide), Jenn-Ming Song (National Chung Hsing Univ.)

15:15 〜 15:30

[G-1-05] Superconducting Hollow TSV for Quantum Computing

^○Jaber Derakhshandeh¹, Roy Li¹, Geraldine Jamieson¹, Gabriela dos Santos², Bogdan Govoreanu¹, Andy Miller1¹, Eric Beyne¹ (1. IMEC (Belgium), 2. Beneq (Finland))

https://doi.org/10.7567/SSDM.2023.G-1-05

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講演情報

[G-1] Advanced Metallization I

[G-1-05] Superconducting Hollow TSV for Quantum Computing

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