The Japan Society of Applied Physics

2023 International Conference on Solid State Devices and Materials

2023 International Conference on Solid State Devices and Materials

Sep 5, 2023 - Oct 31, 2023
Nagoya Congress Center

4:00 PM - 4:30 PM

[G-2-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

○Tadashi Inoue1 (1. MMI Semiconductor Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2023.G-2-01

Wafer bonding techniques suitable for MEMS are discussed from the viewpoint of manufacturing commercial products. In this talk, a guideline for the selection of wafer bonding techniques is shown based on examples of how these techniques have been applied to our MEMS products over the last three decades. We indicate the direction in which wafer bonding technology in MEMS should go.