Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform

Gauri Vibhakar Karve

doi:https://doi.org/10.7567/SSDM.2023.G-2-04

5:00 PM - 5:15 PM

[G-2-04] Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform

^○Gauri Vibhakar Karve¹, Yunlong Li², Vasyl Motsnyi¹, Wei Wei¹, Jakob Visker¹, Francois Chancerel¹, Jan Ackaert¹, Renaud Puybaret¹, Barundeb Dutta¹, Deniz Sabuncuoglu Tezcan¹, Lan Peng¹, Philippe Soussan¹, Simone Severi¹, Haris Osman¹ (1. IMEC (Belgium), 2. Zhejiang University (China))

https://doi.org/10.7567/SSDM.2023.G-2-04

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Presentation information

[G-2] MEMS and Advanced Metallization I

[G-2-04] Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform

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