2023 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-4] Advanced Metallization II

Thu. Sep 7, 2023 10:45 AM - 12:00 PM Room G (231, Bldg. 2)

Session Chairs: Xun Gu (ASM Japan), Takeo Minari (NIMS)

11:00 AM - 11:15 AM

[G-4-02] Dielectric Breakdown of Low Temperature Deposited SiCN Layers

Lin Hou1, Venkat Sunil Kumar Channam2, Alicja Lesniewska2, Serena Lacovo2, Shuo Kang2, Joeri De Vos2, Anne Jourdain2, Gerald Beyer2, Kristof Croes2, Edward Walsby3, Kath Crook3, Igor Belov3, Yangyin Chen1, Yan Li1, Eric Beyne2 (1. Western Digital (United States of America), 2. IMEC (Belgium), 3. SPTS (United States of America))

https://doi.org/10.7567/SSDM.2023.G-4-02

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