2023 International Conference on Solid State Devices and Materials

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Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-4] Advanced Metallization II

Thu. Sep 7, 2023 10:45 AM - 12:00 PM Room G (231, Bldg. 2)

Session Chairs: Xun Gu (ASM Japan), Takeo Minari (NIMS)

11:30 AM - 11:45 AM

[G-4-04] Electrical Properties of Reactive Sputtered Ti or V - based MAX alloy Thin Films

○Kazuki Ueda1, Kazunobu Wakamatsu1, Takeyasu Saito1, Naoki Okamoto1 (1. Osaka Metropolitan University (Japan))

https://doi.org/10.7567/SSDM.2023.G-4-04

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