2023 International Conference on Solid State Devices and Materials

Presentation information

Print

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

Fri. Sep 8, 2023 9:00 AM - 10:15 AM Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

9:00 AM - 9:30 AM

[G-5-01 (Invited)] EMIB and Advanced Substrate Packaging Technologies to Enable Heterogeneous Integration (HI) Applications

○Gang Duan1, Ravi Mahajan1, Rahul Manepalli1, Hamid Azimi1 (1. Intel Corp. (United States of America))

https://doi.org/10.7567/SSDM.2023.G-5-01

Abstract password authentication.
PA password is required to view abstracts. You can find the password in the "Advance Program".The "Advance Program" is handed out at the registration desk to registered participants.

Password