EMIB and Advanced Substrate Packaging Technologies to Enable Heterogeneous Integration (HI) Applications

Gang Duan

doi:https://doi.org/10.7567/SSDM.2023.G-5-01

講演情報

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

2023年9月8日(金) 09:00 〜 10:15 Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

09:00 〜 09:30

[G-5-01 (Invited)] EMIB and Advanced Substrate Packaging Technologies to Enable Heterogeneous Integration (HI) Applications

^○Gang Duan¹, Ravi Mahajan¹, Rahul Manepalli¹, Hamid Azimi¹ (1. Intel Corp. (United States of America))

https://doi.org/10.7567/SSDM.2023.G-5-01

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講演情報

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

[G-5-01 (Invited)] EMIB and Advanced Substrate Packaging Technologies to Enable Heterogeneous Integration (HI) Applications

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