High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

Chang Liu

doi:https://doi.org/10.7567/SSDM.2023.G-5-02

Presentation information

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

Fri. Sep 8, 2023 9:00 AM - 10:15 AM Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

9:30 AM - 9:45 AM

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

^○Chang Liu¹, Tadaaki Hoshi¹, Jiayi Shen¹, Atsushi Shinoda¹, Zehua Du¹, Hisashi Kino^1,2, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomedical Eng., Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.G-5-02

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Presentation information

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

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