2023 International Conference on Solid State Devices and Materials

講演情報

Focus Session

Focus Session (Area 1&3)

[G-5] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet I

2023年9月8日(金) 09:00 〜 10:15 Room G (231, Bldg. 2)

Session Chairs: Takeyasu Saito (Osaka Metropolitan Univ.), François Andrieu (CEA-Leti)

09:30 〜 09:45

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

Chang Liu1, Tadaaki Hoshi1, Jiayi Shen1, Atsushi Shinoda1, Zehua Du1, Hisashi Kino1,2, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomedical Eng., Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.G-5-02

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