Packaging for Heterogeneous Integration: An Equipment Supplier’s Perspective

Amulya Athayde

doi:https://doi.org/10.7567/SSDM.2023.G-6-02

講演情報

Focus Session

Focus Session (Area 1&3)

[G-6] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet II

2023年9月8日(金) 10:45 〜 12:00 Room G (231, Bldg. 2)

Session Chairs: Takeshi Nogami (IBM Research), Nicolas Planes (STMicroelectronics)

11:15 〜 11:45

[G-6-02 (Invited)] Packaging for Heterogeneous Integration: An Equipment Supplier’s Perspective

^○Amulya Athayde¹ (1. Applied Materials, Inc. (United States of America))

https://doi.org/10.7567/SSDM.2023.G-6-02

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講演情報

[G-6] Heterogenous Integration for High Performance Computing; System, Material, Process and Chiplet II

[G-6-02 (Invited)] Packaging for Heterogeneous Integration: An Equipment Supplier’s Perspective

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