Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration

Soodoo Chae

doi:https://doi.org/10.7567/SSDM.2023.K-2-04

4:45 PM - 5:00 PM

[K-2-04] Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration

^○Soodoo Chae¹, Hojin Kim¹, Nayoung Bae¹, Stephen Mancini², Lior Huli¹, Steven Gueci¹, Dave Hetzer¹, Sitaram Arkalgud¹ (1. TEL Technology Center, America, LLC (United States of America), 2. College of Nanoscale Science and Engineering (United States of America))

https://doi.org/10.7567/SSDM.2023.K-2-04

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Presentation information

[K-2] Emerging Memory Devices

[K-2-04] Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration

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