Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

Mu-Ping Hsu

doi:https://doi.org/10.7567/SSDM.2023.PS-3-01

[PS-3-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

^○Mu-Ping Hsu¹, Hsin-Chi Chang¹, Yi-Chieh Tsai¹, Kuan-Neng Chen¹ (1. National Yang Ming Chiao Tung Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-3-01

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講演情報

[PS-3] 03: Interconnect / 3D Integrations / MEMS

[PS-3-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

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