2023 International Conference on Solid State Devices and Materials

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Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

[PS-3-03] On the Study of ESD-Induced Electromigration in CMOS Metallization

○Yang-Shou Hou1, Chun-Yu Lin1 (1. National Taiwan Normal Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-3-03

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