2023 International Conference on Solid State Devices and Materials

講演情報

印刷

Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 15:00 〜 17:00 Shirotori Hall (Nagoya Congress Center)

[PS-3-03] On the Study of ESD-Induced Electromigration in CMOS Metallization

○Yang-Shou Hou1, Chun-Yu Lin1 (1. National Taiwan Normal Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-3-03

Abstract password authentication.
A password is required to view abstracts. You can find the password in the "Advance Program".The "Advance Program" is handed out at the registration desk to registered participants.

パスワード