2023 International Conference on Solid State Devices and Materials

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Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 15:00 〜 17:00 Shirotori Hall (Nagoya Congress Center)

[PS-3-04] Characteristic Verification of Flexible Printed Circuit Applied to System Circuit and Package with High Frequency and High Speed

Meng-Hua TU1, CHIA-LIN HSIEH1, Sung-Mao Wu1, Shang-Chih Chou2 (1. National University of Kaohsiung (Taiwan), 2. Taiwan Textile Research Institute (Taiwan))

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