2023 International Conference on Solid State Devices and Materials

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Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

[PS-3-07 (Late News)] Light Enhanced Direct Copper Bonding and the Drop Test Reliability

Zong-Yu Xie1, Po-Kai Huang1, ○Wei-Ting Chen1, Chih-Pin Hung2, Kiyokazu Yasuda3, Jenn-Ming Song1,3,4 (1. National Chung Hsing University (Taiwan), 2. Advanced Semiconductor Engineering Group (Taiwan), 3. Division of Materials and Manufacturing Science (Japan), 4. Innovation and Development Center of Sustainable Agriculture (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-3-07

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