2023 International Conference on Solid State Devices and Materials

Presentation information

Poster Session

03: Interconnect / 3D Integrations / MEMS

[PS-3] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

[PS-3-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez1, Akio Wakejima2, Atsushi Tanaka3, Tadatomo Suga1 (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.PS-3-08

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