Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez

doi:https://doi.org/10.7567/SSDM.2023.PS-3-08

[PS-3-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez¹, Akio Wakejima², Atsushi Tanaka³, ^○Tadatomo Suga¹ (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))

https://doi.org/10.7567/SSDM.2023.PS-3-08

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講演情報

[PS-3] 03: Interconnect / 3D Integrations / MEMS

[PS-3-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

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