○Bing- Syuan Li1, Tsung-Han Chiang2, You-Chen Weng3, Tsung-Ying Yang2, Edward Yi Chang2,4, Chin-Han Chung2, Michel Khoury5, Helen Zhao5
(1. Master’s Degree Program of Applied Science and Technology, College of Science, National Yang Ming Chiao Tung Univ. (Taiwan), 2. International College of Semiconductor Technology, National Yang Ming Chiao Tung Univ. (Taiwan), 3. College of Photonics, National Yang Ming Chiao Tung Univ. (Taiwan), 4. Department of Materials Science and Engineering, National Yang Ming Chiao Tung Univ. (Taiwan), 5. Applied Materials, Ltd. (United States of America))
https://doi.org/10.7567/SSDM.2023.PS-4-10
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