Improvement of Noise and Output Power Performance in GaN HEMT with Thick Cu-Interconnection for Satellite System Applications

Po-Wei CHEN

doi:https://doi.org/10.7567/SSDM.2023.PS-4-13

[PS-4-13] Improvement of Noise and Output Power Performance in GaN HEMT with Thick Cu-Interconnection for Satellite System Applications

^○Po-Wei CHEN¹, Chieh Cheng¹, Yueh-Chin Lin¹, Edward Yi Chang¹ (1. Univ. National Yang Ming Chiao Tung (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-4-13

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Presentation information

[PS-4] 04: Power / High‐speed Devices and Materials

[PS-4-13] Improvement of Noise and Output Power Performance in GaN HEMT with Thick Cu-Interconnection for Satellite System Applications

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