2023 International Conference on Solid State Devices and Materials

Presentation information

Poster Session

05: Photonics: Devices / Integration / Related Technology

[PS-5] 05: Photonics: Devices / Integration / Related Technology

Thu. Sep 7, 2023 3:00 PM - 5:00 PM Shirotori Hall (Nagoya Congress Center)

[PS-5-01] Photonic Inter-Layer Vias for Three-Dimensional Optical Signal Transmission and Effect of Increased Surface Recombination Velocity

Yu-Chien Wei1, Ming-Hua Mao1,2,3 (1. Graduate Inst. of Electronics Eng., National Taiwan Univ. (Taiwan), 2. Department of Electrical Eng., National Taiwan Univ. (Taiwan), 3. Graduate Inst. of Photonics and Optoelectronics, National Taiwan Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-5-01

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