Photonic Inter-Layer Vias for Three-Dimensional Optical Signal Transmission and Effect of Increased Surface Recombination Velocity

Yu-Chien Wei

doi:https://doi.org/10.7567/SSDM.2023.PS-5-01

[PS-5-01] Photonic Inter-Layer Vias for Three-Dimensional Optical Signal Transmission and Effect of Increased Surface Recombination Velocity

^○Yu-Chien Wei¹, Ming-Hua Mao^1,2,3 (1. Graduate Inst. of Electronics Eng., National Taiwan Univ. (Taiwan), 2. Department of Electrical Eng., National Taiwan Univ. (Taiwan), 3. Graduate Inst. of Photonics and Optoelectronics, National Taiwan Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2023.PS-5-01

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Presentation information

[PS-5] 05: Photonics: Devices / Integration / Related Technology

[PS-5-01] Photonic Inter-Layer Vias for Three-Dimensional Optical Signal Transmission and Effect of Increased Surface Recombination Velocity

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