2023 International Conference on Solid State Devices and Materials

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:30 PM - 1:32 PM

[SO-PS-03-01] Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology

○Mu-Ping Hsu1, Hsin-Chi Chang1, Yi-Chieh Tsai1, Kuan-Neng Chen1 (1. National Yang Ming Chiao Tung Univ. (Taiwan))

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