2023 International Conference on Solid State Devices and Materials

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:40 PM - 1:42 PM

[SO-PS-03-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

○Karl Gerard Herman Ceulemans1, Ehsan Shafahian1, Katia Devriendt1, Herbert Struyf1, Jaber Derakhshandeh1 (1. IMEC (Belgium))

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