Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

Karl Gerard Herman Ceulemans

講演情報

Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

2023年9月7日(木) 13:30 〜 13:46 Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

13:40 〜 13:42

[SO-PS-03-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

^○Karl Gerard Herman Ceulemans¹, Ehsan Shafahian¹, Katia Devriendt¹, Herbert Struyf¹, Jaber Derakhshandeh¹ (1. IMEC (Belgium))

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講演情報

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

[SO-PS-03-06] Chemical Mechanical Polishing for Indium Bond Pad Damascene Processing

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