2023 International Conference on Solid State Devices and Materials

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Short Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[SO-PS-03] 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 7, 2023 1:30 PM - 1:46 PM Room G (231, Bldg. 2)

Session Chairs: Kenji Shiojima (Univ. of Fukui), Takeo Minari (NIMS)

1:44 PM - 1:46 PM

[SO-PS-03-08 (Late News)] Surface Activated Thermo-compression Bonding of GaN to Carbon-composite and Diamond Substrate for Heat Dissipation System Applications

Nora Martinez1, Akio Wakejima2, Atsushi Tanaka3, ○Tadatomo Suga1 (1. Meisei Univ. (Japan), 2. Nagoya Inst. Tech. (Japan), 3. Nagoya Univ. (Japan))

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