*Z. Wu¹, L. Che¹, P. Tang¹, J. He¹, Z. Lv¹, X. Li¹ (1.CISRI HIPEX Technology Co., Ltd., China)

*J. Shipley¹, A. Magnusson¹, R. Thunholm¹, M. Karlsson², C. Beamer³ (1.Quintus Technologies AB, Sweden, 2.Quintus Technologies, Japan, 3.Quintus Technologies LLC, USA)

Y. Liu¹, Z. Yan¹, Z. Lv², *J. Li², W. Qi², A. Eklund² (1.Simtec Soft Sweden AB, Sweden, 2.CISRI-HIPEX TECHNOLOGY CO., LTD, China)

*H. Shen¹, A. Suzuki¹, N. Takata¹, M. Kobashi¹ (1.Nagoya University, Japan)

*L. Lemarquis¹, T. de Terris², L. de Baglion¹, L. Millot¹, Y. Shen², M. Hajjaj³, N. Boudebza² (1.Framatome SAS, France, 2.EDF R and D, France, 3.EDF Direction Industrielle, France)

*C. Broeckmann^1,2, A. Kaletsch^1,2, Y. Deng^1,2 (1.RWTH Aachen University, Institute for Materials Applications in Mechanical Engineering, Germany, 2.Institute of Applied Powder Metallurgy and Ceramics (IAPK) at RWTH Aachen e. V., Germany)

*A. Magnusson¹, J. Shipley¹, M. Karlsson², C. Beamer³ (1.Quintus Technologies AB, Sweden, 2.Quintus Technologies CO Ltd, Japan, 3.Quintus Technologies LLC, USA)