[T10] Other Processing

[16P-T10-01] Vacuum Diffusion Bonding between ODS-W and Cu with CrCoNi Medium-Entropy Alloy Interlayer by Spark Plasma Sintering

D. Xu^{1, 2, 3}, C. Sang^{1, 2, 3}, R. Chen^{1, 2, 3}, P. Chen^{1, 2, 3}, *J. Cheng^{1, 2, 3} (1.Hefei University of Technology, China, 2.Research Center for Powder Metallurgy Engineering and Technology of Anhui Province, China, 3. Engineering Research Center of High-Performance Copper Alloy Materials and Processing, China)

Keywords:ODS-W/Cu joints, CrCoNi interlayer, Diffusion bonding

The performance differences between W and Cu are a challenging issue in divertor components manufacturing. In this study, using CrCoNi medium-entropy alloy (MEA) as an interlayer, oxide dispersed strengthened tungsten (ODS-W) and Cu were successfully bonded by spark plasma sintering, and the effect of bonding temperature on the interfacial diffusion behavior and mechanical properties of ODS-W/Cu joints were investigated. The use of MEA interlayer suppresses the formation of intermetallic compounds at the interface. Instead, the interfacial diffusion zone exhibits the formation of W(Cr, Co, Ni)ss and Cu(Cr, Co, Ni)ss, thereby establishing a reliable metallurgical combination. As the bonding temperature increases, the element diffusion at the interface gradually escalates, resulting in the improvement of the mechanical properties of the joints. Notably, the ODS-W/Cu joints achieves a maximum shear strength of 248.5 MPa at a bonding temperature of 1000 °C, which is 80% higher than that of the direct diffusion bonded joints.