15:50 〜 16:10
[16D-T17-01] Hot-Processing of High-Thermal Conductive Copper/Diamond Composites
キーワード：copper/diamond, hot processing, powder metallurgy, thermal conductivity, heat-sink material
Copper/diamond composites are the next generation of heat-sink materials for high-power electronic devices. However, it is difficult to machine the composites into particularly shaped products due to the high hardness of diamond-reinforced particles. We successfully rapidly synthesis the copper/diamond composites from powders through plastic deformation, which has a great potential to achieve near-net forming. The results showed that an interface layer between the copper matrix and the diamond particles was successfully formed in fabricated copper/diamond composites at the temperature range of 800-1050°C. The interface coverage at the diamond particle surface for the fabricated composite is > 97%. The measured thermal conductivity and coefficient of thermal expansion for the fabricated composite are about 550 W/mK and 6×10-6/K (at 313 K). This demonstrates that the developed method has the feasibility to near-net shape copper/diamond composites with acceptable thermophysical properties as effective thermal management materials for practical engineering applications.