[T20] Materials Characterization of AM Materials

[16P-T20-04] Analyzing Multi-Material Deformation in Additive Manufacturing Using Digital Image Correlation

*J.-S. Ha¹, J.-W Kim¹, S.-B. Han¹, J.-W. Hong¹, H.-J. Song¹, H.-J. Lee¹, J.-S. Jang¹ (1.Korea Institute of Industrial Technology, Korea)

Keywords:Digital Image Correlation, Additive Manufacturing, Multi-Material

This study investigates the deformation of multi-materials in Additive Manufacturing (AM) using Digital Image Correlation (DIC), focusing specifically on deformation under tensile stress. DIC was employed to analyze the differential deformation responses between the substrate and layered materials in AM structures. This method provides a detailed observation of which material experiences greater deformation, offering key insights into material compatibility and interaction in the AM process. Such insights are crucial for understanding the mechanical properties and deformation mechanisms of multi-materials in AM. The findings of this research guide towards optimized material selection and enhanced mechanical stability in AM applications, advancing our understanding of material behavior under stress.