International Display Workshops General Incorporated Association

15:20 〜 15:40

[FMC2-1(Invited)] Surface Strain Analysis of Bending Substrates for Design of Flexible Devices

*Atsushi Shishido1 (1. Tokyo Institute of Technology (Japan))

Flexible, Foldable, Wearable, Strain, Bending

https://doi.org/10.36463/idw.2019.0628

Fracture and fatigue of bending flexible materials and devices prevent their commercialization. The problem is that quantitative understanding has not been explored on bending behavior. Here we report quantitative analysis of surface strain of bending substrates by a surface labeled grating method.