International Display Workshops General Incorporated Association

Proceedings of the International Display Workshops Volume 27 (IDW '20)

Proceedings of the International Display Workshops Volume 27 (IDW '20)

2020年12月9日 〜 2020年12月11日
Virtual Conference

17:50 〜 18:05

[FLX3-4L] Effect of Pressure Thermoforming Conditions on PC Sheet integrating Electric Wiring for 3D Electronics Technology

*Yuki Kawamura1, Tatsuhiro Takahashi1, Katsutomo Wakabayashi2, Haruto Hirose2, Yuka Azakami2, Haruhiko Itoh3, Tadahiro Furukawa1 (1. Yamagata University(Japan), 2. Fujikura Kasei Co., Ltd.(Japan), 3. TEIJIN LIMITED(Japan))

3D Electronics, Pressure thermoforming, Thermoformable conductive paste

https://doi.org/10.36463/idw.2020.0909

As a new method for “3D Electronics”, we have investigated the effect of pressure thermoforming conditions on PC sheet integrating Electric Wiring. By evaluating sheet deformation and disconnection behavior of electric wiring, we found that long-pressing time and early pressing timing were especially significant parameters of process conditions.