17:50 〜 18:05

[FLX3-4L] Effect of Pressure Thermoforming Conditions on PC Sheet integrating Electric Wiring for 3D Electronics Technology

*Yuki Kawamura¹, Tatsuhiro Takahashi¹, Katsutomo Wakabayashi², Haruto Hirose², Yuka Azakami², Haruhiko Itoh³, Tadahiro Furukawa¹ (1. Yamagata University(Japan), 2. Fujikura Kasei Co., Ltd.(Japan), 3. TEIJIN LIMITED(Japan))

3D Electronics, Pressure thermoforming, Thermoformable conductive paste

https://doi.org/10.36463/idw.2020.0909