Mini/Micro LED are highly desirable for next-generation consumer displays. However, the potential application of Mini/Micro LED are strongly hindered by their potential high-temperature damages after the LED surface mounting process. Herein, a new low-cost strategy for Mini-LED backlight with a 4-Mask process is reported, which used MoTi/Cu/MoTi 3-layer S/D electrodes structure to replace additional ITO layer. The electrical performance and bond strength of LED and chip on film(COF) of backlight system was comparable to those of 5-Mask Mini-LED backlight.