Given the demand of stable performance, barrier materials are necessary for thin-film transistors (TFTs) to optimize the adhesion and atom diffusion of Cu layer. In this paper, we successfully demonstrate that the MoTiNi alloy (MTN) has great potential as Cu barrier layer. Notably, due to its excellent antioxidant property, MTN can also be used for bonding protection of novel displays, such as Mini-LED and Micro-LED.