Array of GaN Micro-LED Chips and Monocrystal Si CMOS Pixel Circuit Chips Mounted on Flexible Substrate

Tetsuya Goto, Takeshi Okuno, Yoshikazu Suzuki, Koichi Kajiyama, Yoshihiko Muramoto, Shigetoshi Sugawa

doi:https://doi.org/10.36463/idw.2021.0219

[FMC2-4L] Array of GaN Micro-LED Chips and Monocrystal Si CMOS Pixel Circuit Chips Mounted on Flexible Substrate

FMC Workshop

*Tetsuya Goto¹, Takeshi Okuno², Yoshikazu Suzuki², Koichi Kajiyama², Yoshihiko Muramoto³, Shigetoshi Sugawa¹ (1.Tohoku University (Japan), 2.V-Technology Co., Ltd. (Japan), 3.Nitride Semiconductors Co., Ltd. (Japan))

Micro-LED display, GaN, Monocrystal Si CMOS Circuit Chip, Laser Lift-off, Pulse-width modulation

https://doi.org/10.36463/idw.2021.0219

This paper proposes new micro-LED display fabrication processes. GaN micro-LED and monocrystal Si CMOS chips with pixel circuit to drive LED are mounted in an array shape on a flexible substrate using laser lift-off processes. The emission intensity of LED could be successfully controlled by pulse-width modulation.

Proceedings of the International Display Workshops Volume 28 (IDW '21)

[FMC2-4L] Array of GaN Micro-LED Chips and Monocrystal Si CMOS Pixel Circuit Chips Mounted on Flexible Substrate

FMC Workshop