High Resolution Technology of FPD Exposure Tools and a New Broadband Illumination Technique to Achieve 1.0 μm L&S Resolution

Toru Okubo, Manabu Hakko, Nobuhiko Yabu, Kazuki Toyoda, Miwako Ando, Takeo Oyanagi, Yusuke Miyoshi, Ryousuke Fukuoka, Nozomu Izumi, Fumiyasu Ono, Takaaki Terashi, Yoshinori Osaki

doi:https://doi.org/10.36463/idw.2022.0319

[FMCp1-4] High Resolution Technology of FPD Exposure Tools and a New Broadband Illumination Technique to Achieve 1.0 μm L&S Resolution

*Toru Okubo¹, Manabu Hakko¹, Nobuhiko Yabu¹, Kazuki Toyoda¹, Miwako Ando¹, Takeo Oyanagi¹, Yusuke Miyoshi¹, Ryousuke Fukuoka¹, Nozomu Izumi¹, Fumiyasu Ono¹, Takaaki Terashi¹, Yoshinori Osaki¹ (1.Canon Inc. (Japan))

Lithography, FPD, High resolution, DUV, RET

https://doi.org/10.36463/idw.2022.0319

To meet the demand for high resolution in flat panel display (FPD) market, we have developed Gen. 6 exposure tools “MPAsp-E903T” for 1.2 μm L&S. With the use of resolution enhancement techniques (RETs), the resolution performance extends to 1.0 μm L&S patterns.

Proceedings of the International Display Workshops Volume 29 (IDW '22)

[FMCp1-4] High Resolution Technology of FPD Exposure Tools and a New Broadband Illumination Technique to Achieve 1.0 μm L&S Resolution