The mass production of flexible display currently relies on laser-based liftoff (LLO) process, where bonding between the carrier glass and flexible polyimide (PI) substrate is removed by laser. However, LLO process accompanies degradation at the bottom surface of the PI substrate and is sensitive to particulates. Here, we report a 2D material-based debonding layer for non-laser-based mechanical liftoff process. We demonstrate that debonding force can...